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學生論文競賽主題說明

前瞻奈米元件技術

本主題範圍涵蓋各類感知運算與人工智慧電子元件的最新發展與新型材料元件應用,特別是奈米元件相關之技術、新型材料、物理與可靠性分析等等,包含(但不限定)以下領域之論文:(1) Nano Device Technology; (2) Memory Technology; (3) High Mobility Channel MOSFETs; (4) High-k/Metal Gate Materials; (5) Process Technology; (6) TFT; (7) Power Device Technology; (8) Nano Device Applications of 2D Materials; (9) Device Modeling and Simulation; (10) Reliability。

 

The section will solicit papers describing original work in advanced nano electron devices for cognitive computing and artificial intelligence (AI) applications in area such as, but not limited to:(1) Nano Device Technology, (2) Memory Technology, (3) High Mobility Channel MOSFETs, (4) High-k/Metal Gate Materials, (5) Process Technology, (6) TFT, (7) Power Device Technology, (8) Nano Device Applications of 2D Materials, (9) Device Modeling and Simulation, (10) Reliability.

下世代記憶體

本主題範圍涵蓋各類下世代新穎記憶體相關研究與應用,例如新材料、新結構、陣列線路設計與元件可靠度分析等,包含(但不限定)以下領域之論文:(1) DRAM; (2) FLASH; (3) Phase Change Memory; (4) Resistive Memory; (5) Magnetic Memory; (6) New Non-volatile Memory; (7) Memory Structure Design and Process; (8) Operation Algorithm; (9) Read/Write Circuit; (10) Memory Modeling and Reliability。

 

This topic include all aspects of next generation memory, new material research, new structure design, array circuit and device reliability, but are not limited to: (1) DRAM, (2) FLASH, (3) Phase Change Memory, (4) Resistive Memory, (5) Magnetic Memory, (6) New Non-volatile Memory, (7) Memory Structure Design and Process, (8) Operation Algorithm, (9) Read/Write Circuit, (10) Memory Modeling and Reliability.

前瞻感測器與高頻技術

本主題範圍涵蓋兩大部分,第一部分是前瞻感測器,涵蓋微機電致動器、感測器、3D IC異質整合應用相關的基礎建構與設計,包含(但不限定)以下領域之論文:(1) MEMS Actuator; (2) MEMS Sensor; (3) MEMS Process Technology; (4) MEMS Package & Testing; (5) Nano-scale Film; (6) Biosensors and Nano-structured Sensors; (7) Biomaterials Used for the Electronic Devices; (8) Electronic Manipulation of Biomolecules; (9) Bio-fuel Cells; (10) Fabrication of Nanowires; (11) Applications of Nanowires on Biomedical Devices or Diagnostics; (12) 3D IC Design and Application; (13) 3D Device Process and Integration; (14) Monolithic 3DIC。
第二部分是高頻技術,主要為射頻/微波/毫米波領域的元件、電路與系統之技術與應用,包含(但不限定)以下領域之論文:(1) High-frequency Device Fabrication, Characterization and Modeling; (2) High-frequency Circuit Design and Simulation; (3) High-frequency Systems and Applications; (4) High-frequency Passive Devices; (5) High-frequency Measurement Techniques and EM Field Analysis; (6) Antennas and Propagation。

 

First topic covers all aspects of MEMS actuator, sensor and 3D IC integration application, but are not limited to: (1) MEMS Actuator, (2) MEMS Sensor, (3) MEMS Process Technology, (4) MEMS Package & Testing, (5) Nano-scale Film, (6) Biosensors and Nano-structured Sensors, (7) Biomaterials Used for The Electronic Devices, (8) Electronic Manipulation of Biomolecules, (9) Bio-fuel Cells, (10) Fabrication of Nanowires, (11) Applications of Nanowires on Biomedical Devices or Diagnostics, (12) 3D IC Design and Application, (13) 3D Device Process and Integration, (14) Monolithic 3DIC.
Second topic covers technologies and applications of RF/microwave/millimeter-wave devices, circuits and systems, including (but not limited to) (1) High-frequency Device Fabrication, Characterization and Modeling, (2) High-frequency Circuit Design and Simulation, (3) High-frequency Systems and Applications, (4) High-frequency Passive Devices, (5) High-frequency Measurement Techniques and EM Field Analysis, and (6) Antennas and Propagation.

新穎材料與元件分析技術

本主題範圍涵蓋各類材料或元件相關之檢測分析及檢測技術最新發展與應用,包含(但不限定)以下領域之論文:(1) 材料影像分析技術:SEM、AFM、C-AFM、SCM、STM、SSRM、MFM、TEM 及 SNOM; (2) 材料晶體結構分析技術:TEM 及XRD; (3) 材料成分分析技術:EDS、AES、XPS、SIMS 及 FTIR; (4) 低溫磁場分析技術:Low-temperature I-V Measurement、Low-temperature Magnetoelectrical Measurement。

 

Topics of interest for submission include all aspects of materials characterizations, novel analyzed techniques, and its application, but are not limited to: (1) Scanning Image Analysis:SEM, AFM, C-AFM, SCM, STM, SSRM, MFM, TEM and SNOM, (2) Structural Diffraction Analysis:TEM and XRD, (3) Chemical Elemental Analysis:EDS, AES, XPS, SIMS and FTIR, (4) Low-temperature High-magnetic Field Analysis:Low-temperature I-V Measurement and Low-temperature Magnetoelectrical Measurement.

 

 

 

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